< img height="1" width="1" style="display:none" src="https://www.facebook.com/tr?id=1029820091747592&ev=PageView&noscript=1" /> What Is CO2 Laser Marking Machine - Laserscheme


What Is CO2 Laser Marking Machine

CO2 Laser Marking Machine principle: CO2 laser marking machine that is, carbon dioxide laser marking machine (CO2 is carbon dioxide). Is the use of CO2 gas as the working medium of the laser vibration mirror marking machine. CO2 Laser Marking machine is CO2 laser to CO2 gas as the medium, the CO2 and other auxiliary gas into the discharge tube on the electrode plus high pressure, discharge tube to produce glow discharge, so that the gas release wavelength of 10.64um laser, the laser energy amplification, after the vibration mirror scanning and F-Theta mirror focus,

Under the control of computer and laser marking control card, images, text, numbers and lines can be engraved on the workpiece according to the requirements of the user.

CO2 Laser Marking unit: CO2 Laser Marking machine is mainly composed of CO2 laser, 10.64-field mirror, 10.64 beam expansion mirror, CO2 laser power supply, scanning vibration mirror, control computer, laser control card, laser control software, laser machine rack, laser circulating water system, circuit control system and other components. CO2 Laser Marking Machine main features: the use of carbon dioxide lasers, is a universal model, post-focus mode, small size, high degree of integration. The machine is suitable for a large number of non-metallic materials marking, such as paper packaging, plastic products, non-metallic labels, leather fabrics, glass ceramics, resin plastic, bamboo products, PCB board and so on. CO2 Laser is a gas laser with a wavelength of 10.64um in the Far Infrared optical band, using CO2 gas to charge the discharge tube as the medium to produce the laser, when the voltage is raised on the electrode and the glow discharge is produced in the discharge tube, the gas molecule can release the laser, and the laser energy will be amplified to form a laser beam for the material processing.

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