educe the influence of thermal effects in the processing of thin-film non-metallic materials, semiconductor wafer cutting, plexiglass cutting, drilling, marking and other fields, it is hoped that the small aperture spot effect and high peak power are so outstanding and indispensable. Substitute.
For metal processing, most of the wavelengths are in the infrared band, and high power and high heat are expected to process the metal, but its infrared or visible light is usually processed by means of high-brightness local heating to vaporize and melt the material. However, this kind of heat will cause the surrounding materials in the laser area to be affected or even destroyed, thus limiting the quality of the processing edge and the scope of industrial application. The ultraviolet laser is a short-wavelength high-energy photon laser, which directly destroys the chemical bonds of the atomic components of the material without generating heat. Therefore, the ultraviolet laser processing is generally called “cold” processing.
There are two main types of ultraviolet lasers on the market: gas ultraviolet lasers and solid-state ultraviolet lasers. Solid-state ultraviolet lasers occupy a large share in the market due to their high efficiency and small size. Solid-state ultraviolet lasers also have the advantages of semiconductor pump lasers: low heat loss, high crystal absorption efficiency, easy maintenance, and high peak power.
Solid-state ultraviolet lasers generally select infrared light with a fundamental frequency of 1064nm to output 266nm at a triple frequency, or first to 532nm, and then combine the 532nm frequency doubled light and the unconverted fundamental frequency to 355nm for output.
Ultraviolet laser processing has the following applications in the high-end application market: wafer substrate cutting, solar panel cutting, glass material cutting, organic material marking, microcircuit production, micro-nano processing and so on. Generally, the wafer material is hard and small in size, and the processing accuracy is high. The physical dicing machine is used for processing, and the separation method is split, which will cause chipping, poor notch, blade passivation and other phenomena, which limit the improvement of product yield. The laser performs the sapphire substrate, and the cutting of the semiconductor wafer substrate can obtain a smaller cut, and high-speed cutting without the influence of the hot zone, which greatly improves the yield.
Driven by the rise of smart phones, the application of UV lasers gradually has room for development. In the past, because mobile phones did not have many functions and the cost of laser processing was high, laser processing did not occupy much position in the mobile phone market. However, smart phones now have many functions and are highly integrated. It is necessary to integrate data in a limited space. Ten kinds of sensors and hundreds of functional devices, and high component costs, have greatly increased the accuracy, yield, and processing requirements. Ultraviolet lasers have developed a variety of applications in the mobile phone industry.
The biggest feature of smart phones is the touch screen function. Capacitive touch screens can achieve multi-touch. Corresponding to resistive touch screens, it has longer life and faster response. Therefore, capacitive touch screens have become the mainstream choice for smart phones.
Ceramics has always occupied an important role in human history, and its footprints can be seen from daily necessities, decorative items to industrial applications. In the last century, the application of electronic ceramics has gradually matured, with a wider range of applications, such as heat dissipation substrates, piezoelectric materials, resistors, semiconductor applications, biological applications, etc. In addition to traditional ceramic processing technology, ceramic processing has also entered due to the increase in applications In the field of laser processing. According to the type of ceramic materials, it can be divided into functional ceramics, structural ceramics and bioceramics. Lasers that can be used to process ceramics include CO2 lasers, YAG lasers, green lasers, etc. However, with the gradual miniaturization of components and YAG laser or fiber laser processing can no longer meet its requirements, UV laser processing has become a necessary processing method. He can process many types of ceramics.
